Component mounting sequence is critical to the efficiency of surface mounting machines.

元器件贴装顺序是影响贴片机工作效率的关键因素之一。

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Provided are a chip component mounting structure and a chip component mounting method for increasing density.

本发明涉及可实现高密度化的芯片部件的安装构造以及安装方法。

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The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined.

本发明旨在提供一种能够组合可修复性和冲击抗性的电子部件安装结构。

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Together these mounting vendor wars will drive incremental demand for component suppliers, but longer-term investors will need to identify those suppliers that are well positioned with those few companies that will be the ultimate hardware winners.

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